BW Global Tech Corp. has the solution to TSV mechanical clamping. Recent publications have illustrated TSV processing of silicon and glass substrates using mechanical clamping. Our new electrostatic glass clamp will hold the glass / silicon substrate on the glass side. This will reduce front side particles, allow more die per wafer, and increase the heat flow through the device during processing.
The article referenced is in the September 2009 issue of http://e-ditionsbyfry.com/Olive/AM3/WAD/Default.htm?href=WAD/2009/07/01 The magazine defaults to the July 2009 issue. You need to select the September 2009 issue, page 20 to see the article.
If you have problems with the above magazine hyperlink you can select the magazine at http://www.waferpackaging.com
The title of the article is "Part Two, A New TSV Technology for CMOS Image Sensor Packaging". Some lines directly quoted from the article are:
The first step was bonding a 200mm glass wafer onto a 200mm silicon wafer.
The wafer was pre-thinned to 380um.
The process was done with mechanical clamping between the Si/glass and the tool cooling chuck.
We can improve your process results by transitioning your system from mechanically clamped to electrostatic clamping. See our electrostatic glass clamping device by following this link GCD.
Call us to discuss this solution at 775-853-8130
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